|
Our Company Products List -
Mayloon Products
|
|
Written by AIN Substrate
|
|
Sunday, 20 December 2009 13:16 |
| Aluminum Nitride Substrate |  Aluminum Nitride Substrate | | | | Characteristics: | |  | | ◆ High thermal conductivity. | | | ◆ Pengzhang coefficient of thermal silicon close. | | | ◆ High insulation resistance, low dielectric constant. | | | ◆ Anti-corrosion high temperature, | | | ◆ Strong qualitative component Wen. | | | | | | | Application : | | | | | ◆ High-power transistors template. | | | | ◆ High-power light emitting diode (LED) package template. | | | | ◆ High-frequency device substrate. | | | | ◆ Hybrid module, ignition module, | | | | ◆ Hot-die substrate, and so fast ... | | | | | | | | | | | | | | | | | | | | Property Content | Property Index | | | | Density(g/cm3) | ≥3.3 g/cm3 | | | | Water absorption (%) | 0 | | | | Thermal conductivity(20℃, W/m.k) | ≥170 | | | | Linear expansion coefficient (RT-400℃,10-6/℃) | 4.6 | | | | Flexural strength (MPa) | ≥330 | | | | Bulk resistance (Ω.cm) | ≥1013 | | | | Dielectric constant(1MHz) | 9.0 | | | | Dissipation factor (1MHz) | 3.8×10-4 | | | | Dielectric strength (KV/mm) | ≧17 | | | | Surface roughness Ra(μm) | 0.3~0.5 | | | | Camber (~/25.4(length)) | 0.03~0.05 | | | | Appearance | Dense | | | | | | | Items | Type | 尺寸 (mm) | Dry Pressing Disk | (DPD) | Φ26, Φ27, Φ30, Φ35, Φ40, Φ50, Φ51.5, Φ60, Φ80. |
|
| Type | L | W | T | Unit | Tape Casting | | No.1143 | 114.3 | 114.3 | 0.3~1.0 | mm | Substrate | (TCS) | No.1016 | 101.6 | 101.6 | 0.3~1.0 | mm |
| | No.762 | 76.2 | 76.2 | 0.25~1.0 | mm | | | No.508 | 50.8 | 50.8 | 0.25~1.0 | mm |
|
|
Last Updated on Tuesday, 22 December 2009 16:08 |
